About the role
Requisition ID: 296038
- Relocation Authorized: National - Family
- Telework Type: Full-Time Office/Project
- Work Location: Chandler, AZ
Extraordinary teams building inspiring projects:
Since 1898, we have helped customers complete more than 25,000 projects in 160 countries on all seven continents that have created jobs, grown economies, improved the resiliency of the world's infrastructure, increased access to energy, resources, and vital services, and made the world a safer, cleaner place.
Differentiated by the quality of our people and our relentless drive to deliver the most successful outcomes, we align our capabilities to our customers' objectives to create a lasting positive impact. We serve the Infrastructure; Nuclear, Security & Environmental; Energy; Mining & Metals, and the Manufacturing and Technology markets. Our services span from initial planning and investment, through start-up and operations.
Core to Bechtel is our Vision, Values and Commitments . They are what we believe, what customers can expect, and how we deliver. Learn more about our extraordinary teams building inspiring projects in our Impact Report .
Project Overview:
Fab 62 is an advanced semiconductor fabrication facility for Intel Corporation, located at Intel's Ocotillo campus in Chandler, Arizona. As part of this work, the M&T team is responsible for delivering the engineering, procurement, and construction scope required to complete and finish-out a leading-edge chipmaking facility - a highly demanding environment where precision, cleanliness, schedule certainty, and coordination across thousands of craft and professional personnel are essential to success. The project supports the continued expansion of domestic semiconductor manufacturing capacity, contributing to a more resilient technology supply chain while creating significant opportunity for the local Arizona workforce. Joining the Fab 62 team means contributing directly to one of the most strategically important construction efforts in the United States and helping deliver the infrastructure behind the next generation of microelectronics."